High-Temperature Ceramic Adhesive
Description
Alumina-based inorganic adhesives for ceramic joining, sealing and high-temperature repair. The Chinese catalog identifies separate GZ-TC series for different bonding tasks.
CHARACTERISTICS
- Formulated from alumina precursors, short fibers and inorganic constituents
- Grade-dependent curing routes
- Suitable for discussion of ceramic joints and insulation-layer repairs
SPECIFICATION
| Property | Reference information |
|---|---|
| GZ-TC311 series | High-temperature ceramic bonding |
| GZ-TC320 series | Ultra-high-temperature multiphase ceramic bonding |
| GZ-TC330 series | High-temperature repair bonding |
| Reported room-temperature shear strength | 1.5–20 MPa, across the listed family |
| Reported shear strength at 1200°C | 1.5–10 MPa, across the listed family |
PERFORMANCE
The source quotes maximum temperature resistance of 1700–2050°C, with 2050°C in its family table. It does not assign that limit to each grade or provide the complete test conditions. Confirm the grade, joint geometry and exposure duration; the family maximum is not a continuous-use rating for every bonded assembly.
CUSTOMIZATION
Specify substrate materials, bond-line thickness, thermal cycle, atmosphere and required cure route. The source lists ambient-, medium- and high-temperature curing options without a full schedule.
APPLICATION
- Alumina and other ceramic joining
- Si/SiC and C/SiC joining development
- Thermal insulation-layer bonding
- High-temperature repair and insulating seals
CERTIFICATION
Request the current technical data sheet, safety data sheet and applicable inspection reports for the supplied grade. The source page does not provide a verified product certificate number or approval scope.
Inquiry
Ask about: High-Temperature Ceramic Adhesive
