Temporary Bonding and Release Adhesive
Description
A single-component polymer adhesive described on the Chinese site for thinning and release processes involving thin materials and complex components.
CHARACTERISTICS
- Single-component formulation
- Adjustable red appearance
- Temporary bonding and elevated-temperature release applications
SPECIFICATION
| Property | Reference information |
|---|---|
| Appearance | Red; adjustable |
| Components | Single component |
| Density | 0.95–1.00 g/cm³ |
| Listed hardness | D 50 |
| Listed shear strength | 5 MPa |
| Listed modulus | 480 MPa |
| Listed tensile strength | 132 MPa |
| Listed elongation at break | 20% |
PERFORMANCE
These are source-table reference values without specimen or test-method details. The published viscosity and curing-energy units are inconsistent, so obtain a current process sheet before defining viscosity, irradiation or release conditions.
CUSTOMIZATION
Discuss the bonded materials, thickness, allowable residue, release temperature and subsequent cleaning process.
APPLICATION
- Glass processing
- Electronic and electrical components
- Optical component processing
CERTIFICATION
Request the current technical data sheet, safety data sheet and applicable inspection reports for the supplied grade. The source page does not provide a verified product certificate number or approval scope.
Inquiry
Ask about: Temporary Bonding and Release Adhesive
